Invention Grant
- Patent Title: Loudspeaker assembly configuration
- Patent Title (中): 扬声器装配配置
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Application No.: US14714618Application Date: 2015-05-18
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Publication No.: US09451345B2Publication Date: 2016-09-20
- Inventor: Mark Burleson , Richard Little
- Applicant: Sonos, Inc.
- Applicant Address: US CA Santa Barbara
- Assignee: Sonos, Inc.
- Current Assignee: Sonos, Inc.
- Current Assignee Address: US CA Santa Barbara
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H04R9/06
- IPC: H04R9/06 ; H04R1/00 ; H04R9/04 ; H04R31/00

Abstract:
Embodiments are provided for configurations of a loudspeaker and assembly of the loudspeaker. The loudspeaker may include a frame; a voice coil; a magnetic structure having a magnetic gap; a surround; a spider; and a staggered circumferential spacer element. The staggered circumferential spacer element may include an upper tier attached to an outer rim of the surround; and a lower tier attached to an outer rim of the spider. The staggered circumferential spacer may be coupled to the frame such that the voice coil is suspended at least partially within the magnetic gap.
Public/Granted literature
- US20150264457A1 Loudspeaker Assembly Configuration Public/Granted day:2015-09-17
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