Invention Grant
- Patent Title: In-ear headphone
- Patent Title (中): 入耳式耳机
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Application No.: US13161537Application Date: 2011-06-16
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Publication No.: US09451351B2Publication Date: 2016-09-20
- Inventor: Sead Smailagic , Martin Nyström
- Applicant: Sead Smailagic , Martin Nyström
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee: Sony Corporation,Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Tucker Ellis LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
A headphone device includes a housing having a leakage hole to reduce pressure between a user's ear and the housing, a speaker positioned within the housing, and an audio processing module. The audio processing module is configured to receive an audio signal from an audio device, determine whether the audio signal includes at least a predetermined level of audio having a frequency in a first range of frequencies, transmit a first leakage control signal to a leakage hole valve when it is determined that the audio includes at least the predetermined level of low frequency audio; and transmit a second leakage control signal to the leakage hole valve when it is determined that the audio does not include at least the predetermined level of low frequency audio. The leakage hole valve is configured to close the leakage hole upon receipt of the first leakage control signal and open the leakage hole upon receipt of the second leakage control signal.
Public/Granted literature
- US20120321103A1 IN-EAR HEADPHONE Public/Granted day:2012-12-20
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