Invention Grant
- Patent Title: Print element substrate, method of manufacturing the same, printhead and printing apparatus
- Patent Title (中): 打印元件基板，其制造方法，打印头和打印装置
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Application No.: US14465446Application Date: 2014-08-21
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Publication No.: US09451692B2Publication Date: 2016-09-20
- Inventor: Noriyuki Kurita , Keiichi Sasaki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2013-185701 20130906
- Main IPC: B41J2/165
- IPC: B41J2/165 ; H05K1/02 ; B41J2/14 ; B41J2/16
Abstract:
A method of manufacturing a print element substrate, comprising preparing a substrate, including a first region and a second region, in which a printing portion is formed on the first region, and a wiring pattern connected to the printing portion is formed on the first region and the second region, forming an insulating film covering the printing portion and the wiring pattern, and forming a conductive cavitation-resistant film on the insulating film, wherein in the forming the insulating film, the insulating film is formed such that a side surface of a portion of the insulating film, which is formed on the second region, includes an inclined face.
Public/Granted literature
- US20150070434A1 PRINT ELEMENT SUBSTRATE, METHOD OF MANUFACTURING THE SAME, PRINTHEAD AND PRINTING APPARATUS Public/Granted day:2015-03-12
Information query
IPC分类:
