Invention Grant
US09451695B2 Epoxy resin compound and radiant heat circuit board using the same
有权
环氧树脂复合物和使用其的辐射热电路板
- Patent Title: Epoxy resin compound and radiant heat circuit board using the same
- Patent Title (中): 环氧树脂复合物和使用其的辐射热电路板
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Application No.: US14119122Application Date: 2012-05-21
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Publication No.: US09451695B2Publication Date: 2016-09-20
- Inventor: Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
- Applicant: Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik Lloyd & Eisenschenk
- Priority: KR10-2011-0048109 20110520
- International Application: PCT/KR2012/003991 WO 20120521
- International Announcement: WO2012/161490 WO 20121129
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08K3/10 ; C08K3/22 ; C08K3/36 ; C08K3/38 ; H05K1/05 ; C08G59/62 ; C08G59/68 ; C09K5/14 ; C08K3/28 ; C08K3/00
Abstract:
An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
Public/Granted literature
- US20140231122A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME Public/Granted day:2014-08-21
Information query
