Invention Grant
- Patent Title: Circuit board, electronic device, and method of manufacturing circuit board
- Patent Title (中): 电路板,电子设备及制造电路板的方法
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Application No.: US14017567Application Date: 2013-09-04
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Publication No.: US09451699B2Publication Date: 2016-09-20
- Inventor: Yasunari Ukita
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2012-164101 20120724
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34 ; H05K1/02

Abstract:
According to one embodiment, a circuit board is provided with a first rectangular electronic component, a board and a reinforcing plate. The first electronic component has a plurality of connection terminals. The board has the first electronic component mounted thereon via the connection terminals, and has a through hole for receiving a second electronic component at a position at which the first electronic component overlaps with the second electronic component. The reinforcing plate is attached to the back surface of the board, and has a plurality of first portions near the corner portions of the first electronic component, and a second portion of a strip shape coupling the first portions and located near the hole. The first and second portions are formed integral as one body.
Public/Granted literature
- US20140029216A1 CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD Public/Granted day:2014-01-30
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