Invention Grant
US09451719B2 U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure
有权
U形智能电子设备（IED）硬件平台与IED接线匹配，从非U形尺寸IED硬件平台采用适配器结构
- Patent Title: U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure
- Patent Title (中): U形智能电子设备（IED）硬件平台与IED接线匹配，从非U形尺寸IED硬件平台采用适配器结构
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Application No.: US14013064Application Date: 2013-08-29
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Publication No.: US09451719B2Publication Date: 2016-09-20
- Inventor: Shamsi Ismayilov , Yaser A. Khalifa , Frantisek Koudelka , Arkady Oksengorn , Siu Lau , Hardik Patel , In Y. Choi
- Applicant: ABB Technology AG
- Applicant Address: CH Zurich
- Assignee: ABB Technology AG
- Current Assignee: ABB Technology AG
- Current Assignee Address: CH Zurich
- Agency: Manelli Selter PLLC
- Agent Edward J. Stemberger
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; H05K13/00 ; H05K7/14
Abstract:
A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
Public/Granted literature
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