Invention Grant
US09451726B2 Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
有权
管理液体淹没电子设备阵列的冷却剂压力和流量的方法和装置
- Patent Title: Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
- Patent Title (中): 管理液体淹没电子设备阵列的冷却剂压力和流量的方法和装置
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Application No.: US14036307Application Date: 2013-09-25
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Publication No.: US09451726B2Publication Date: 2016-09-20
- Inventor: Laurent Regimbal , Sean Archer , Steve Shafer , Lyle R. Tufty
- Applicant: LiquidCool Solutions, Inc.
- Applicant Address: US MN Rochester
- Assignee: LiquidCool Solutions, Inc.
- Current Assignee: LiquidCool Solutions, Inc.
- Current Assignee Address: US MN Rochester
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
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