Invention Grant
- Patent Title: Integrated sensors
- Patent Title (中): 集成传感器
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Application No.: US13452218Application Date: 2012-04-20
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Publication No.: US09453793B2Publication Date: 2016-09-27
- Inventor: Alexandre M Bratkovski , R Stanley Williams , Zhiyong Li
- Applicant: Alexandre M Bratkovski , R Stanley Williams , Zhiyong Li
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dierker & Kavanaugh, P.C
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/01 ; G01N21/65 ; G01N21/64

Abstract:
Examples of integrated sensors are disclosed herein. An example of an integrated sensor includes a flexible substrate, and an array of spaced apart sensing members formed on a surface of the flexible substrate. Each of the spaced apart sensing members includes a plurality of polygon assemblies. The polygon assemblies are arranged in a controlled pattern on the surface of the flexible substrate such that each of the plurality of polygon assemblies is a predetermined distance from each other of the plurality of polygon assemblies, and each of the plurality of polygon assemblies including collapsible signal amplifying structures controllably positioned in a predetermined geometric shape.
Public/Granted literature
- US20140028995A1 INTEGRATED SENSORS Public/Granted day:2014-01-30
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