Invention Grant
US09455217B2 Semiconductor package including multiple chips and separate groups of leads
有权
半导体封装包括多个芯片和独立的引线组
- Patent Title: Semiconductor package including multiple chips and separate groups of leads
- Patent Title (中): 半导体封装包括多个芯片和独立的引线组
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Application No.: US14528572Application Date: 2014-10-30
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Publication No.: US09455217B2Publication Date: 2016-09-27
- Inventor: Chul Park , Hyeong-seob Kim , Kun-dae Yeom , Gwang-man Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0022747 20090317
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/50 ; H01L23/535 ; H01L25/065 ; H01L23/00
Abstract:
Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
Public/Granted literature
- US20150054144A1 SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE CHIPS AND SEPARATE GROUPS OF LEADS Public/Granted day:2015-02-26
Information query
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