Invention Grant
- Patent Title: Substrate with multiple encapsulated devices
- Patent Title (中): 具有多个封装器件的基板
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Application No.: US13563626Application Date: 2012-07-31
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Publication No.: US09455353B2Publication Date: 2016-09-27
- Inventor: Po-Jui Chen , Gary Yama , Matthieu Liger , Andrew Graham
- Applicant: Po-Jui Chen , Gary Yama , Matthieu Liger , Andrew Graham
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot Moore & Beck LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L29/66 ; B81C1/00 ; G01C19/5783 ; G01P15/08 ; G01P15/18
Abstract:
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
Public/Granted literature
- US20140035071A1 Substrate with Multiple Encapsulated Devices Public/Granted day:2014-02-06
Information query
IPC分类:
