Invention Grant
- Patent Title: High current-carrying printed circuit board and method for producing said printed circuit board
- Patent Title (中): 大载流印刷电路板及其制造方法
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Application No.: US14001083Application Date: 2012-02-20
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Publication No.: US09456491B2Publication Date: 2016-09-27
- Inventor: Stefan Peck , Jan Keller
- Applicant: Stefan Peck , Jan Keller
- Applicant Address: DE Hannover
- Assignee: Continental Automotive GmbH
- Current Assignee: Continental Automotive GmbH
- Current Assignee Address: DE Hannover
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102011004526 20110222
- International Application: PCT/EP2012/052879 WO 20120220
- International Announcement: WO2012/113762 WO 20120830
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A printed circuit board includes a busbar applied to a surface of the printed circuit board. The busbar is configured as a sequence of sheet metal conductor pieces which are connected to each other in an electrically conducting manner. The respective ends of the conductor pieces may have a rounded portion and a corresponding cutout, or a point and a corresponding indentation. An electrical controller, a motor vehicle and a printed circuit board configuration having at least one printed circuit board are also provided.
Public/Granted literature
- US20140124248A1 HIGH CURRENT-CARRYING PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAID PRINTED CIRCUIT BOARD Public/Granted day:2014-05-08
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