Invention Grant
- Patent Title: Structural body and interconnect substrate
- Patent Title (中): 结构体和互连基板
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Application No.: US13816690Application Date: 2011-07-20
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Publication No.: US09456499B2Publication Date: 2016-09-27
- Inventor: Hiroshi Toyao , Toru Taura
- Applicant: Hiroshi Toyao , Toru Taura
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-216567 20100928
- International Application: PCT/JP2011/004096 WO 20110720
- International Announcement: WO2012/042717 WO 20120405
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K1/02 ; H01P1/04 ; H05K1/16
Abstract:
A structural body includes a first conductor having a first opening; a second conductor, having a second opening, which is opposite to at least a portion of the first conductor; a conductor via, passing through the first opening and the second opening, which is insulated from the first conductor and the second conductor; a first interconnect, provided in the inside of the first opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end and which is opposite to the second conductor; and a second interconnect, provided in the inside of the second opening, of which one end thereof is connected to the conductor via and the other end thereof is formed as an open end, and which is opposite to the first conductor.
Public/Granted literature
- US20130140071A1 STRUCTURAL BODY AND INTERCONNECT SUBSTRATE Public/Granted day:2013-06-06
Information query
