An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.