Invention Grant
- Patent Title: Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method
- Patent Title (中): 除水方法，光纤焊接法和半导体激光器模块的制造方法
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Application No.: US14478383Application Date: 2014-09-05
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Publication No.: US09457415B2Publication Date: 2016-10-04
- Inventor: Akira Sakamoto
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-053766 20120309
- Main IPC: B23K1/20
- IPC: B23K1/20 ; G02B6/42 ; F26B3/28 ; F26B3/30
Abstract:
A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light.
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