Invention Grant
- Patent Title: Laser machining device
- Patent Title (中): 激光加工装置
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Application No.: US13131429Application Date: 2009-11-20
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Publication No.: US09457424B2Publication Date: 2016-10-04
- Inventor: Makoto Nakano , Takashi Inoue
- Applicant: Makoto Nakano , Takashi Inoue
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2008-305143 20081128
- International Application: PCT/JP2009/069722 WO 20091120
- International Announcement: WO2010/061794 WO 20100603
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/03 ; B23K26/04 ; B23K26/08 ; C03B33/02 ; B23K26/40

Abstract:
A laser machining device which can suppress the aberration of a laser beam converged into an object to be machined is provided. The device includes a laser light source for emitting a laser beam and a reflective spatial light modulator for modulating the laser beam emitted from the laser light source (202), while first mirrors for reflecting the laser beam are disposed between the laser light source and reflective spatial light modulator in an optical path of the laser beam and configured such as to be able to adjust the direction of reflection of the laser beam. Therefore, by regulating the direction of reflection of the laser beam at each of the mirrors, the device can adjust the position and incident angle of the laser beam incident on the reflective spatial light modulator as desired. Hence, the laser beam can precisely be made incident on the reflective spatial light modulator.
Public/Granted literature
- US20110266261A1 LASER MACHINING DEVICE Public/Granted day:2011-11-03
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