Invention Grant
- Patent Title: Method for manufacturing metal encapsulation member
- Patent Title (中): 金属封装件制造方法
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Application No.: US14260575Application Date: 2014-04-24
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Publication No.: US09457550B2Publication Date: 2016-10-04
- Inventor: Dong Jin Lee , Yoo Jin Lee , Jae Hak Lee
- Applicant: TGO Tech. Corporation
- Applicant Address: KR
- Assignee: TGO TECH. CORPORATION
- Current Assignee: TGO TECH. CORPORATION
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0049383 20130502
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L33/52 ; B32B38/10 ; B32B37/18 ; H01L51/52 ; H01L33/56 ; H01L33/54 ; B32B37/12 ; B32B38/00 ; B32B38/18
Abstract:
A method for manufacturing a metal encapsulation member is disclosed. The method comprises: preparing a substrate on one side of which an adhesive material is applied; adhering a metal member onto the one side of the substrate; attaching an adhesive member onto the metal member; and removing predetermined portions of the metal member and the adhesive member.
Public/Granted literature
- US20140326402A1 METHOD FOR MANUFACTURING METAL ENCAPSULATION MEMBER Public/Granted day:2014-11-06
Information query
IPC分类:
