Invention Grant
- Patent Title: Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate
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Application No.: US14299511Application Date: 2014-06-09
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Publication No.: US09457554B2Publication Date: 2016-10-04
- Inventor: Shigeto Izumi
- Applicant: NIKON CORPORATION
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: JP2009-223344 20090928; JP2009-233882 20091007; JP2009-233885 20091007
- Main IPC: B32B37/10
- IPC: B32B37/10 ; B32B41/00 ; H01L21/67 ; H01L21/687
Abstract:
A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.
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