Invention Grant
- Patent Title: Gravure offset printing method, gravure offset printing device, and gravure plate
- Patent Title (中): 凹版印刷法,凹版印刷装置和凹版印刷
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Application No.: US14761716Application Date: 2014-01-16
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Publication No.: US09457558B2Publication Date: 2016-10-04
- Inventor: Yasuhiro Sente , Tomoko Okamoto , Yoshinori Katayama
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2013-006142 20130117
- International Application: PCT/JP2014/050678 WO 20140116
- International Announcement: WO2014/112557 WO 20140724
- Main IPC: B41M1/10
- IPC: B41M1/10 ; B41F3/36 ; B41F13/193 ; B41F3/20

Abstract:
Provided are a gravure offset printing method, a gravure offset printing apparatus, and a gravure plate that allow a fine wiring pattern to be accurately printed on the material to be printed. A gravure offset printing method executed by a gravure offset printing apparatus includes a step of filling a groove on a gravure plate with a printing paste, a step of offsetting the printing paste from the groove on the gravure plate to the blanket, and a step of transferring the printing paste from the blanket to a substrate. The groove on the gravure plate includes a region having a width of 100 to 700 μm in a direction perpendicular to a print direction. The region has a leading end tapered forward in the print direction and a trailing end split into a pair of branches by a notch tapered forward in the print direction.
Public/Granted literature
- US20150352829A1 GRAVURE OFFSET PRINTING METHOD, GRAVURE OFFSET PRINTING DEVICE, AND GRAVURE PLATE Public/Granted day:2015-12-10
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