Invention Grant
US09458010B1 Systems and methods for anchoring components in MEMS semiconductor devices
有权
用于在MEMS半导体器件中锚固组件的系统和方法
- Patent Title: Systems and methods for anchoring components in MEMS semiconductor devices
- Patent Title (中): 用于在MEMS半导体器件中锚固组件的系统和方法
-
Application No.: US14805924Application Date: 2015-07-22
-
Publication No.: US09458010B1Publication Date: 2016-10-04
- Inventor: Ruben B. Montez , Robert F. Steimle
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/36
- IPC: H01L21/36 ; B81C1/00 ; B81B7/00
Abstract:
A method of making a semiconductor device forms anchors for one or more layers of material. The method includes depositing a first layer of material on a substrate, applying a mask over the first layer of material to mask nanoparticle-sized areas of the first material, removing portions of the first layer of material to form a first set of recesses around the nanoparticle-sized areas of the first material, depositing a second layer of material in the recesses and over the nanoparticle-sized areas so that a second set of recesses is formed in a top surface of the second layer of material, and forming a component of the semiconductor device over the second layer of material. Material of a bottom surface of the component is included in the second set of recesses.
Information query
IPC分类:
