Invention Grant
- Patent Title: Resin composition and use thereof
- Patent Title (中): 树脂组合物及其用途
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Application No.: US12993721Application Date: 2009-05-14
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Publication No.: US09458279B2Publication Date: 2016-10-04
- Inventor: Yoshihide Sekito
- Applicant: Yoshihide Sekito
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-144983 20080602
- International Application: PCT/JP2009/058975 WO 20090514
- International Announcement: WO2009/147938 WO 20091210
- Main IPC: C08G18/75
- IPC: C08G18/75 ; C08G18/34 ; C08G18/44 ; C08G18/66 ; C08G73/10 ; C09D179/08 ; G03F7/027 ; G03F7/037 ; H01B3/30 ; H01B3/40 ; H05K3/28

Abstract:
An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.
Public/Granted literature
- US20110061915A1 NOVEL RESIN COMPOSITION AND USE THEREOF Public/Granted day:2011-03-17
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