Invention Grant
US09458284B2 Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin
有权
含羧基的树脂，用于焊接掩模的树脂组合物，以及制备含羧基的树脂的方法
- Patent Title: Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin
- Patent Title (中): 含羧基的树脂，用于焊接掩模的树脂组合物，以及制备含羧基的树脂的方法
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Application No.: US14357827Application Date: 2012-11-13
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Publication No.: US09458284B2Publication Date: 2016-10-04
- Inventor: Michiya Higuchi , Hisashi Marusawa , Fumito Suzuki , Yoshio Sakai
- Applicant: GOO CHEMICAL CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: GOO CHEMICAL CO., LTD.
- Current Assignee: GOO CHEMICAL CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Cheng Law Group, PLLC
- Priority: JP2011-249746 20111115
- International Application: PCT/JP2012/079351 WO 20121113
- International Announcement: WO2013/073518 WO 20130523
- Main IPC: G03F7/038
- IPC: G03F7/038 ; C08G59/17 ; C08G59/14 ; G03F7/027 ; C08G59/42 ; C08L63/04 ; H05K3/28 ; H05K3/34
Abstract:
The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.
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