Invention Grant
US09458309B2 Molding material and liquid ejection flow path member using the same
有权
成型材料和使用其的液体喷射流路构件
- Patent Title: Molding material and liquid ejection flow path member using the same
- Patent Title (中): 成型材料和使用其的液体喷射流路构件
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Application No.: US14674243Application Date: 2015-03-31
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Publication No.: US09458309B2Publication Date: 2016-10-04
- Inventor: Isao Imamura , Yoshiyuki Shino , Shogo Kawamura
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2014-088978 20140423
- Main IPC: C08K5/521
- IPC: C08K5/521 ; C08K3/36 ; C08K3/22 ; C08K5/21 ; B41J2/14 ; C08K5/5435
Abstract:
The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.
Public/Granted literature
- US20150307689A1 MOLDING MATERIAL AND LIQUID EJECTION FLOW PATH MEMBER USING THE SAME Public/Granted day:2015-10-29
Information query
