Invention Grant
US09458358B2 Article, compositions, systems, and methods using selectively detackified adhesives
有权
使用选择性脱胶粘合剂的制品，组合物，系统和方法
- Patent Title: Article, compositions, systems, and methods using selectively detackified adhesives
- Patent Title (中): 使用选择性脱胶粘合剂的制品，组合物，系统和方法
-
Application No.: US14585365Application Date: 2014-12-30
-
Publication No.: US09458358B2Publication Date: 2016-10-04
- Inventor: Robert H. De Boer , Ronald Haycox , Pavel Janko , Dave Whitman
- Applicant: Avery Dennison Corporation
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J7/00 ; C09J133/08 ; G09F3/10 ; B05D5/10 ; B32B7/12 ; C09J151/00 ; C09J5/00 ; G21K5/02 ; C09J151/06 ; C08F265/06
Abstract:
Adhesive compositions are described which can be selectively detackified or deadened. Articles using such adhesive compositions are also described. Also described are techniques in which select regions of adhesive layers in the articles are detackified. Also described are systems and methods using the various articles and adhesive compositions. And particular label constructions are described.
Public/Granted literature
- US20150191633A1 Article, Compositions, Systems, and Methods Using Selectively Detackified Adhesives Public/Granted day:2015-07-09
Information query
