Invention Grant
- Patent Title: Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid
- Patent Title (中): 包含特定含硫化合物和糖醇或多元羧酸的后化学机械抛光（CMP后）清洁组合物
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Application No.: US14376978Application Date: 2013-01-24
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Publication No.: US09458415B2Publication Date: 2016-10-04
- Inventor: Yuzhuo Li , Shyam Sundar Venkataraman , Mingjie Zhong
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/IB2013/050625 WO 20130124
- International Announcement: WO2013/118013 WO 20130815
- Main IPC: C11D7/34
- IPC: C11D7/34 ; C11D3/34 ; H01L21/02 ; C11D3/20 ; C11D7/26 ; C11D11/00 ; C11D3/37
Abstract:
A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (—SH), thioether (—SR1) or thiocarbonyl (>C═S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least three hydroxyl (—OH) groups and does not comprise any carboxylic acid (—COOH) or carboxylate (—COO—) groups, and (C) an aqueous medium.
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