Invention Grant
- Patent Title: Semiconductor manufacturing device and semiconductor manufacturing method
- Patent Title (中): 半导体制造装置及半导体制造方法
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Application No.: US14482075Application Date: 2014-09-10
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Publication No.: US09458535B2Publication Date: 2016-10-04
- Inventor: Katsunori Shibuya , Takashi Imoto , Soichi Homma , Takeshi Watanabe , Yuusuke Takano
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Priority: JP2013-257783 20131213
- Main IPC: G01R31/20
- IPC: G01R31/20 ; C23C14/50 ; C23C14/54 ; H01L23/552 ; C23C14/56 ; H01L21/677

Abstract:
A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.
Public/Granted literature
- US20150167156A1 SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD Public/Granted day:2015-06-18
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