Systems and methods for separating components of a multilayer stack of electronic components are disclosed herein. The multilayer stack may include an electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate. The methods may include locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell and generating a potential difference between a cathode portion of the electronic assembly and the sacrificial anode portion. The methods further may include separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive solution.