Invention Grant
- Patent Title: Round-robin sensing device and method of use
- Patent Title (中): 循环感测装置及其使用方法
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Application No.: US13958465Application Date: 2013-08-02
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Publication No.: US09459274B2Publication Date: 2016-10-04
- Inventor: Derek Shaeffer , Stanley Wang
- Applicant: InvenSense, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA Sunnyvale
- Agency: Duane Morris LLP
- Agent Amir Tabarrok
- Main IPC: G01P1/04
- IPC: G01P1/04 ; G01C19/5776

Abstract:
A round-robin sensing device is disclosed. The round-robin sensing device comprises a MEMS device, wherein the MEMS device includes first and second sense electrodes. The round-robin sensing device also comprises a multiplexer coupled to the first and second sense electrodes, at least one sense amplifier coupled to the multiplexer, a demodulator coupled to the at least one sense amplifier, and an integrate and dump circuit coupled to the demodulator. Finally, the round-robin sensing device comprises an analog-to-digital converter (ADC) coupled to the de-multiplexer, wherein the multiplexer, the at least one sense amplifier and the demodulator provide a continuous time sense path during amplification that is resettable and wherein the integrate and dump circuit and the ADC provide a discrete time processing path.
Public/Granted literature
- US20140260619A1 ROUND-ROBIN SENSING DEVICE AND METHOD OF USE Public/Granted day:2014-09-18
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