Invention Grant
- Patent Title: Socket, and test apparatus and method using the socket
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Application No.: US13484845Application Date: 2012-05-31
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Publication No.: US09459281B2Publication Date: 2016-10-04
- Inventor: Byeong-Hwan Cho
- Applicant: Byeong-Hwan Cho
- Applicant Address: KR Samsung-ro, Yeongtang-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtang-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2007-0069259 20070710
- Main IPC: G01R1/04
- IPC: G01R1/04

Abstract:
An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object.
Public/Granted literature
- US20120235695A1 SOCKET, AND TEST APPARATUS AND METHOD USING THE SOCKET Public/Granted day:2012-09-20
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