Invention Grant
- Patent Title: Electronic assembly test system
- Patent Title (中): 电子组装测试系统
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Application No.: US13860423Application Date: 2013-04-10
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Publication No.: US09459312B2Publication Date: 2016-10-04
- Inventor: John Joseph Arena , Anthony J. Suto
- Applicant: Teradyne, Inc.
- Applicant Address: US MA North Reading
- Assignee: Teradyne, Inc.
- Current Assignee: Teradyne, Inc.
- Current Assignee Address: US MA North Reading
- Agency: Choate, Hall & Stewart LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/18
Abstract:
An example system for testing electronic assemblies (EAs) may include carriers for holding EAs and slots for testing at least some of the EAs in parallel. Each slot may be configured to receive a corresponding carrier containing an EA and to test the EA. An example carrier in the system may include a first part and a second part. At least one of the first part and the second part include a first structure, and the first structure is movable to enable electrical connection between an EA and an electrical connector.
Public/Granted literature
- US20140306728A1 ELECTRONIC ASSEMBLY TEST SYSTEM Public/Granted day:2014-10-16
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