Invention Grant
US09459416B2 Package for housing optical semiconductor element and optical semiconductor device
有权
用于外壳光学半导体元件和光学半导体器件的封装
- Patent Title: Package for housing optical semiconductor element and optical semiconductor device
- Patent Title (中): 用于外壳光学半导体元件和光学半导体器件的封装
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Application No.: US14417200Application Date: 2014-01-28
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Publication No.: US09459416B2Publication Date: 2016-10-04
- Inventor: Takeo Satake , Daisuke Tanaka , Daisuke Sakumoto
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-013925 20130129
- International Application: PCT/JP2014/051789 WO 20140128
- International Announcement: WO2014/119550 WO 20140807
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01S5/022

Abstract:
A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.
Public/Granted literature
- US20150205059A1 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2015-07-23
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