Invention Grant
US09459416B2 Package for housing optical semiconductor element and optical semiconductor device 有权
用于外壳光学半导体元件和光学半导体器件的封装

Package for housing optical semiconductor element and optical semiconductor device
Abstract:
A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.
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