Invention Grant
- Patent Title: Substrate processing apparatus, lithography apparatus, and method of manufacturing article
- Patent Title (中): 基板加工装置，光刻装置及制造方法
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Application No.: US14192960Application Date: 2014-02-28
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Publication No.: US09459541B2Publication Date: 2016-10-04
- Inventor: Shinichi Hirano
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2013-044719 20130306
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F9/00
Abstract:
The present invention provides a substrate processing apparatus for performing a process of reducing warpage of a substrate, comprising a substrate stage configured to hold the substrate, a pressing member including a portion formed to press a peripheral portion of the substrate against the substrate stage, an obtaining unit configured to obtain information indicating a shift between a center of a region where a pattern is formed on the substrate and a center of the substrate, and a controller configured to control relative positions of the substrate stage and the pressing member based on the information obtained by the obtaining unit, such that the portion of the pressing member presses the peripheral portion of the substrate.
Public/Granted literature
- US20140253899A1 SUBSTRATE PROCESSING APPARATUS, LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE Public/Granted day:2014-09-11
Information query
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