Invention Grant
- Patent Title: Universal IC tag, method of manufacturing same, and communication management system
- Patent Title (中): 通用IC标签，制造方法以及通信管理系统
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Application No.: US14233908Application Date: 2012-07-20
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Publication No.: US09460381B2Publication Date: 2016-10-04
- Inventor: Kunitaka Arimura
- Applicant: Kunitaka Arimura
- Applicant Address: JP Kawasaki-Shi
- Assignee: Smart Co., Ltd.
- Current Assignee: Smart Co., Ltd.
- Current Assignee Address: JP Kawasaki-Shi
- Agent James Creighton Wray; Meera P. Narasimhan
- Priority: JP2011-160357 20110721
- International Application: PCT/JP2012/068415 WO 20120720
- International Announcement: WO2013/012057 WO 20130124
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01Q13/10 ; H01Q1/22 ; H01L21/82
Abstract:
A universal IC tag comprises a metal sheet M1 having a hollow slot functioning as an antenna; plastic sheets laminated on the front and the rear surfaces of the metal sheet M1; an IC arranged in the hollow slot, and a metal sheet M2 laminated on the rear plastic sheet having a reflecting amplifying function. Such universal IC tag can transmits/receive maximum energy by matching IC impedance with slot impedance and by attaining resonance between an IC capacitor and a slot inductance.
Public/Granted literature
- US20140231503A1 Universal IC Tag, Method of Manufacturing Same, and Communication Management System Public/Granted day:2014-08-21
Information query
