Invention Grant
US09460866B2 Method of forming a surface mount component having magnetic layer thereon
有权
在其上形成具有磁性层的表面安装部件的方法
- Patent Title: Method of forming a surface mount component having magnetic layer thereon
- Patent Title (中): 在其上形成具有磁性层的表面安装部件的方法
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Application No.: US13771022Application Date: 2013-02-19
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Publication No.: US09460866B2Publication Date: 2016-10-04
- Inventor: Haixiao Sun
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Priority: WOPCT/CN2005/001299 20050819
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H01G13/00 ; H05K3/30 ; H01G2/02 ; H05K3/24
Abstract:
A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.
Public/Granted literature
- US20160284483A9 METHOD OF FORMING A SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON Public/Granted day:2016-09-29
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