A microplasma generator includes first and second conductive resonators disposed on a first surface of a dielectric substrate. The first and second conductive resonators are arranged in line with one another with a gap defined between a first end of each resonator. A ground plane is disposed on a second surface of the dielectric substrate and a second end of each of the first and second resonators is coupled to the ground plane. A power input connector is coupled to the first resonator at a first predetermined distance from the second end chosen as a function of the impedance of the first conductive resonator. A microplasma generating array includes a number of resonators in a dielectric material substrate with one end of each resonator coupled to ground. A micro-plasma is generated at the non-grounded end of each resonator. The substrate includes a ground electrode and the microplasmas are generated between the non-grounded end of the resonator and the ground electrode. The coupling of each resonator to ground may be made through controlled switches in order to turn each resonator off or on and therefore control where and when a microplasma will be created in the array.