Invention Grant
- Patent Title: Semiconductor device manufacturing method
- Patent Title (中): 半导体器件制造方法
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Application No.: US14746452Application Date: 2015-06-22
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Publication No.: US09460927B2Publication Date: 2016-10-04
- Inventor: Hong-fei Lu
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/265 ; H01L29/06 ; H01L29/36 ; H01L29/40 ; H01L29/66 ; H01L29/739 ; H01L21/268 ; H01L29/167

Abstract:
A semiconductor device manufacturing method for a semiconductor device having a p-n junction formed of a first conductivity type first semiconductor region and a second conductivity type second semiconductor region, and comprising a low-lifetime region that has a carrier lifetime shorter than that in other regions at the interface of the p-n junction. The method includes an implantation process of, after implanting a second conductivity type impurity into the surface of the first semiconductor region with a first acceleration energy, implanting a second conductivity type impurity, with a second acceleration energy differing from the first acceleration energy, into the surface of the first semiconductor region into which the second conductivity type impurity has been implanted.
Public/Granted literature
- US20150287601A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2015-10-08
Information query
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