A method for manufacturing a package-on-package structure may include: providing a support structure having a package attached to an inclined surface of the support structure, the package comprising: a first chip package; a second chip package disposed over the first chip package; and a standoff gap between the first chip package and the second chip package, wherein a first side of the package is disposed higher on the inclined surface of the support structure than a second side of the package; and dispensing an underfill into the standoff gap, the underfill flowing through the standoff gap from the first side of the package to the second side of the package.