A surface of a silicon substrate is coated with a silicon oxide layer. A manganese silicate layer is then deposited on the silicon oxide layer using a process of performing at least one step of dipping the substrate into a manganese amidinate solution. A copper layer is then deposited on the manganese silicate layer using a process of performing a step of dipping the substrate into a copper amidinate solution. An anneal is performed to stabilize one or both of the manganese silicate layer and copper layer.