Invention Grant
- Patent Title: Surface processing progress monitoring system
- Patent Title (中): 表面处理进度监测系统
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Application No.: US14250100Application Date: 2014-04-10
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Publication No.: US09460973B2Publication Date: 2016-10-04
- Inventor: Rui Kato , Yuzo Nagumo , Hiroomi Goto
- Applicant: SHIMADZU CORPORATION
- Applicant Address: JP Kyoto
- Assignee: SHIMADZU CORPORATION
- Current Assignee: SHIMADZU CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-084298 20130412
- Main IPC: G01B11/06
- IPC: G01B11/06 ; H01L21/66 ; H01J37/32

Abstract:
A system including an index assigning section estimating the thickness of a thin film based on the intensity of light reflected on a substrate and a theoretical formula expressing a relationship between the thickness of the thin film and the intensity of an interference light when the spectrum is obtained for the first time, and assigning indexes for each candidate value for the layer thickness; a layer thickness wide-range estimating section estimating the layer thickness within the range of the value of a layer thickness wide-range estimation width including the previously estimated value of the layer thickness based on the theoretical formula; a selecting section selecting an index from the indexes; a determining section determining a layer thickness wide-range estimation result; and a layer thickness determining section determining the thickness of the thin film based on the theoretical formula after calculating the layer thickness wide-range estimation result.
Public/Granted literature
- US20140307262A1 SURFACE PROCESSING PROGRESS MONITORING SYSTEM Public/Granted day:2014-10-16
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