A semiconductor module uses pin bonding and improves cooling capacity. The semiconductor module includes a semiconductor element; a pin electrically and thermally connected to an upper surface of the semiconductor element; a pin wiring substrate having a first metal film and a second metal film respectively provided on the rear and front surfaces of a pin wiring insulating substrate, the first metal film being bonded to the pin; a first DCB substrate having a third metal film and a fourth metal film respectively provided on the rear and front surfaces of a first ceramic insulating substrate, the third metal film being bonded to a lower surface of the semiconductor element; a first cooler thermally connected to the fourth metal film; and a second cooler that thermally connected to the second metal film.