Invention Grant
- Patent Title: Interconnect structure for package-on-package devices and a method of fabricating
- Patent Title (中): 封装封装器件的互连结构和制造方法
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Application No.: US14720154Application Date: 2015-05-22
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Publication No.: US09460987B2Publication Date: 2016-10-04
- Inventor: Jui-Pin Hung , Jing-Cheng Lin , Po-Hao Tsai , Yi-Jou Lin , Shuo-Mao Chen , Chiung-Han Yeh , Der-Chyang Yeh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/528 ; H01L23/538 ; H01L23/28 ; H01L23/498 ; H01L25/10 ; H01L21/768 ; H01L21/82 ; H01L25/18 ; H01L25/00 ; H01L25/065 ; H01L21/56
Abstract:
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
Public/Granted literature
- US20150255447A1 Interconnect Structure for Package-on-Package Devices Public/Granted day:2015-09-10
Information query
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