Invention Grant
- Patent Title: Method and apparatus for assembling a semiconductor package
- Patent Title (中): 用于组装半导体封装的方法和装置
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Application No.: US14722810Application Date: 2015-05-27
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Publication No.: US09461009B1Publication Date: 2016-10-04
- Inventor: Leo M. Higgins, III , Glenn G. Daves
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00 ; H01L21/56 ; H01L23/29 ; H01L23/31 ; H01L21/768
Abstract:
A method of packaging a semiconductor device is described. The method includes: attaching a first surface of a semiconductor die to a carrier; forming one or more first stud bumps on the carrier; using bond wires, electrically connecting one or more locations on a second surface of the semiconductor die to one or more first stud bumps; molding the semiconductor die, the first stud bumps, and the bond wires in an encapsulation material; removing the carrier from the bottom side of the semiconductor package exposing a portion of the first stud bumps; and attaching one or more solder balls to the exposed portion of the first stud bumps.
Information query
IPC分类:
