Invention Grant
- Patent Title: Method and system for template assisted wafer bonding
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Application No.: US14245191Application Date: 2014-04-04
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Publication No.: US09461026B2Publication Date: 2016-10-04
- Inventor: John Dallesasse , Stephen B. Krasulick
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/822
- IPC: H01L21/822 ; H01L25/16 ; H01L23/50 ; H01L33/48 ; H01L21/78 ; H01L23/00 ; H01L31/18 ; H01L33/00 ; H01L33/52 ; H01S5/02 ; H01S5/026
Abstract:
A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.
Public/Granted literature
- US20140342500A1 METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING Public/Granted day:2014-11-20
Information query
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