Invention Grant
- Patent Title: LED package and manufacturing method
- Patent Title (中): LED封装及制造方法
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Application No.: US14419539Application Date: 2013-08-02
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Publication No.: US09461027B2Publication Date: 2016-10-04
- Inventor: Josef Andreas Schug
- Applicant: KONINKLIJKE PHILIPS N.V.
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- International Application: PCT/IB2013/056353 WO 20130802
- International Announcement: WO2014/024108 WO 20140213
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/16 ; H01L23/00 ; H01L25/075 ; H05B33/08 ; H01L21/768 ; H01L21/78 ; H01L23/48 ; H01L27/02 ; H01L33/48 ; H01L33/62
Abstract:
An LED package (40) and manufacturing method in which the package has LED substrate (50) and a circuit substrate (54) bonded together, with the LED over the integrated circuit, and with electrical connection between the LED and corresponding integrated circuit. The package has package terminals (56a, 56b) on one face only with through vias (58a, 58b) providing connection between the LED substrate and the circuit substrate.
Public/Granted literature
- US20150214201A1 LED PACKAGE AND MANUFACTURING METHOD Public/Granted day:2015-07-30
Information query
IPC分类:
