Invention Grant
US09461143B2 Gate contact structure over active gate and method to fabricate same
有权
有源栅极的栅极接触结构及其制造方法
- Patent Title: Gate contact structure over active gate and method to fabricate same
- Patent Title (中): 有源栅极的栅极接触结构及其制造方法
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Application No.: US13622974Application Date: 2012-09-19
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Publication No.: US09461143B2Publication Date: 2016-10-04
- Inventor: Abhijit Jayant Pethe , Tahir Ghani , Mark Bohr , Clair Webb , Harry Gomez , Annalisa Cappellani
- Applicant: Abhijit Jayant Pethe , Tahir Ghani , Mark Bohr , Clair Webb , Harry Gomez , Annalisa Cappellani
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/66 ; H01L21/768 ; H01L29/78

Abstract:
Gate contact structures disposed over active portions of gates and methods of forming such gate contact structures are described. For example, a semiconductor structure includes a substrate having an active region and an isolation region. A gate structure has a portion disposed above the active region and a portion disposed above the isolation region of the substrate. Source and drain regions are disposed in the active region of the substrate, on either side of the portion of the gate structure disposed above the active region. A gate contact structure is disposed on the portion of the gate structure disposed above the active region of the substrate.
Public/Granted literature
- US20140077305A1 GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME Public/Granted day:2014-03-20
Information query
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