Invention Grant
- Patent Title: Multi-layer circuit member with reference circuit
- Patent Title (中): 带参考电路的多层电路元件
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Application No.: US13508401Application Date: 2010-11-04
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Publication No.: US09462676B2Publication Date: 2016-10-04
- Inventor: Kent E. Regnier
- Applicant: Kent E. Regnier
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- International Application: PCT/US2010/055439 WO 20101104
- International Announcement: WO2011/056967 WO 20110512
- Main IPC: H03H7/09
- IPC: H03H7/09 ; H05K1/02 ; H01R13/6469 ; H01R13/66 ; H01R107/00 ; H05K3/34 ; H05K3/42
Abstract:
A multi-layer circuit member includes first and second electrically connected reference regions. At least a portion of a signal conductor is in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.
Public/Granted literature
- US20120280766A1 MULTI-LAYER CIRCUIT MEMBER WITH REFERENCE CIRCUIT Public/Granted day:2012-11-08
Information query
