Invention Grant
- Patent Title: Wiring material, method for fabricating the same, and secondary battery device and electronic equipment using the same
- Patent Title (中): 接线材料及其制造方法以及二次电池装置及使用其的电子设备
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Application No.: US14077865Application Date: 2013-11-12
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Publication No.: US09462684B2Publication Date: 2016-10-04
- Inventor: Kotaro Tanaka , Toshiyuki Horikoshi , Takumi Sato , Kenichi Murakami
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran Cole & Calderon, PC
- Priority: JP2012-250495 20121114; JP2012-250496 20121114; JP2013-118478 20130605; JP2013-118479 20130605
- Main IPC: H01B7/08
- IPC: H01B7/08 ; H05K1/02 ; H01B13/012 ; H05K1/18
Abstract:
A wiring material includes conductors, each of which has a cross section having a thickness and a width not less than the thickness, a trunk portion in which the conductors are spaced parallel in a direction of the width thereof, a branch portion in which each conductor is bent and branched from the trunk portion in the direction of the width or in a direction that intersects the direction of the width, and a covering member for covering the trunk portion and the branch portion to expose both ends of the conductors.
Public/Granted literature
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