A two-dimensional array of bonding pads is formed on a first major surface of a substrate. At least some of the pads are connected to conductors that extend across or into the substrate. The pads can be classified in two groups. A first group is conventional, each pad providing a continuous electrically conductive surface on which a solder ball or solder bump may be formed. In the second group, each pad has a plurality of isolated electrically conductive regions that are connected to different conductors that extend across or into the substrate. Solder balls or solder bumps having a first height are mounted on some of the pads. Multi-terminal devices that have a height that is no more than that of the first height are mounted on at least some of the second group of pads; and their terminals are connected to different electrically conductive regions.