Invention Grant
- Patent Title: Electronic device and method of manufacturing electronic device
- Patent Title (中): 电子设备及其制造方法
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Application No.: US14455204Application Date: 2014-08-08
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Publication No.: US09462693B2Publication Date: 2016-10-04
- Inventor: Keishiro Okamoto , Seiki Sakuyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2013-169476 20130819
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34 ; B23K1/20 ; H01L23/00 ; H05K3/30 ; H01L23/498 ; H01L23/04 ; H01L21/50 ; H05K1/02 ; H01L23/367 ; H01L23/40
Abstract:
An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that include outside surfaces configured to face diagonally upward with respect to the first surface; a second electronic component provided above the first surface; second members that are provided corresponding to the first members on a second surface of the second electronic component which faces the first surface and that include inside surfaces configured to face diagonally downward with respect to the second surface and configured to face the outside surfaces; and solder that is provided between the first surface and the second surface and that electrically connects the first electronic component and the second electronic component.
Public/Granted literature
- US20150049450A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2015-02-19
Information query
