Invention Grant
- Patent Title: Mounting frame to mount a component
- Patent Title (中): 安装框架安装组件
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Application No.: US15211976Application Date: 2016-07-15
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Publication No.: US09462717B1Publication Date: 2016-10-04
- Inventor: Mark David Senatori
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Trop, Pruner & Hu
- Main IPC: A47B96/06
- IPC: A47B96/06 ; H05K7/14

Abstract:
In some examples, a mounting frame includes a wall structure enclosing an inner space of the mounting frame, and first supports attached to the wall structure and mounted at a first height relative to the mounting frame to contact, at the first height, a top surface of a first component having a first component height. Second supports are mounted at a second height relative to the mounting frame to contact, at the second height, a top surface of a second component having a second component height less than the first component height. Each respective second support of the second supports moveable between a first position and a second position, the respective second support when in the first position protruding into a respective opening in the wall structure, and the respective second support when in the second position extending into the inner space to contact the top surface of the second component having the second component height.
Information query