Invention Grant
- Patent Title: Composition and methods of forming solder bump and flip chip using the same
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Application No.: US14325482Application Date: 2014-07-08
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Publication No.: US09462736B2Publication Date: 2016-10-04
- Inventor: Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2008-0067117 20080710; KR10-2009-0011106 20090211
- Main IPC: H05K13/04
- IPC: H05K13/04 ; B23K3/06 ; B23K35/34 ; B23K35/36 ; B82Y10/00 ; B23K35/24 ; H05K3/46 ; H01L23/00 ; H05K3/32 ; H05K3/34
Abstract:
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
Public/Granted literature
- US20140317915A1 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME Public/Granted day:2014-10-30
Information query
